We specialize in the precision coring and resizing of High Value wafers into smaller diameter wafers for research and development teams around the world. We process Patterned silicon, germanium, gallium arsenide, indium phosphide, graphite, silicon carbide, diamond coated wafers, stainless steel wafers, and many others.

Post wafer fabrication and processing, wafers require the edges to be rounded and or beveled to increase the rigidity and stability of the wafer, thus reducing the probability and mitigating the risk of chipping and breaking of these high value materials. 

Through our strategic partnerships, we have access to specialized materials and semiconductor processes throughout the semiconductor industry.