Specializing in Resizing and Coring Wafers
Dynamic Process Group cores and resizes semiconductor wafers from 25.4mm to 450mm on the Synova Laser MicroJet — diameter held to ±150µm, no heat-affected zone, no chipping. Blank or patterned wafers, including CMOS and custom proprietary films, cut to any geometry: round, square, notched, single or multiple flats. Lead times: Standard ~2 weeks, Priority ~1 week, Hot Lot 48 hours. Our coring process flow has been qualified by customers for using laser-cored material in their proprietary bonding processes.
Laser coring covers materials that absorb at 1064nm: silicon, SOI, SiGe, germanium, GaAs, InP, InAs, InSb, GaSb, CdTe/CdZnTe, GaN-on-Si, graphite and diamond-coated silicon. Sapphire, glass, fused silica, quartz and SiC are cored on our CNC service at ±0.2mm. See Wafer Coring and CNC Coring under Services for full specifications.
Specializing in Resizing and Coring Wafers
Dynamic Process Group cores and resizes semiconductor wafers from 25.4mm to 450mm on the Synova Laser MicroJet — diameter held to ±150µm, no heat-affected zone, no chipping. Blank or patterned wafers, including CMOS and custom proprietary films, cut to any geometry: round, square, notched, single or multiple flats. Lead times: Standard ~2 weeks, Priority ~1 week, Hot Lot 48 hours. Our coring process flow has been qualified by customers for using laser-cored material in their proprietary bonding processes.
Laser coring covers materials that absorb at 1064nm: silicon, SOI, SiGe, germanium, GaAs, InP, InAs, InSb, GaSb, CdTe/CdZnTe, GaN-on-Si, graphite and diamond-coated silicon. Sapphire, glass, fused silica, quartz and SiC are cored on our CNC service at ±0.2mm. See Wafer Coring and CNC Coring under Services for full specifications.
Specializing in Resizing and Coring Wafers
Dynamic Process Group cores and resizes semiconductor wafers from 25.4mm to 450mm on the Synova Laser MicroJet — diameter held to ±150µm, no heat-affected zone, no chipping. Blank or patterned wafers, including CMOS and custom proprietary films, cut to any geometry: round, square, notched, single or multiple flats. Lead times: Standard ~2 weeks, Priority ~1 week, Hot Lot 48 hours. Our coring process flow has been qualified by customers for using laser-cored material in their proprietary bonding processes.
Laser coring covers materials that absorb at 1064nm: silicon, SOI, SiGe, germanium, GaAs, InP, InAs, InSb, GaSb, CdTe/CdZnTe, GaN-on-Si, graphite and diamond-coated silicon. Sapphire, glass, fused silica, quartz and SiC are cored on our CNC service at ±0.2mm. See Wafer Coring and CNC Coring under Services for full specifications.
Dynamic Process Group, Inc.
Dynamic ProcessGroup, Inc.
Dynamic Process Group, Inc.
in three lead-time tiers — Standard (~2 weeks), Priority (~1 week) and Hot Lot (48 hours) — and in filling a critical customer need for fast, high-quality work.
in three lead-time tiers — Standard (~2 weeks), Priority (~1 week) and Hot Lot (48 hours) — and in filling a critical customer need for fast, high-quality work.
in three lead-time tiers — Standard (~2 weeks), Priority (~1 week) and Hot Lot (48 hours) — and in filling a critical customer need for fast, high-quality work.